We are seeking a full-time, on-site IC Package Designer based in Karachi, Pakistan. This role is ideal for an experienced individual contributor with at least one year of relevant experience in IC package design. The position focuses on advanced design tasks including BGA and WLCSP layout optimization, signal and power integrity analysis, and co-design efforts aimed at enhancing manufacturability. The work schedule follows a morning shift, and the offered salary ranges from PKR 40,000 to 60,000.

Key Responsibilities
- Perform advanced IC package design activities with a focus on BGA and WLCSP layout optimization.
- Conduct signal and power integrity analysis to ensure optimal performance of IC packages.
- Collaborate closely with cross-functional teams to implement manufacturability-focused co-design strategies.
- Apply industry best practices and design rules to improve package reliability and yield.
- Troubleshoot design issues and provide effective solutions to meet project timelines and quality standards.
- Maintain detailed documentation of design processes and results for internal review and future reference.

Required Qualifications
- Minimum of 1 year of hands-on experience in IC package design.
- Proficiency in BGA and WLCSP layout optimization techniques.
- Strong understanding of signal and power integrity principles and analysis methodologies.
- Familiarity with manufacturability considerations in IC package co-design.
- Ability to work independently as an individual contributor without managerial responsibilities.
- Effective communication skills to collaborate with engineering teams and stakeholders.
- Willingness to work full-time on-site during morning shift hours in Karachi.

Preferred Qualifications and Benefits
- Experience with industry-standard design and analysis tools related to IC packaging.
- Knowledge of emerging trends and technologies in IC package design.
- Opportunity to work in a dynamic environment focused on cutting-edge semiconductor packaging solutions.
- Competitive salary package within the specified range, reflecting experience and expertise.
- Career growth potential through exposure to advanced design challenges and cross-disciplinary collaboration.

This position offers a valuable opportunity for a motivated IC Package Designer to contribute to innovative projects while developing specialized skills in a professional setting. Candidates meeting the criteria are encouraged to apply and join a team dedicated to excellence in semiconductor packaging design.

Job Details

Total Positions:
1 Post
Job Shift:
First Shift (Day)
Job Type:
Job Location:
Gender:
No Preference
Age:
18 - 65 Years
Career Level:
Mid-Level
Maximum Experience:
2 Years
Apply Before:
Aug 28, 2026
Posting Date:
Aug 22, 2026

Advance Package Design

· 11-50 employees - Karachi

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